Sputtering deposition
A film formation technology with excellent reproducibility that utilizes high energy to forge the material itself!
The sputtering method is a technique that involves colliding high-energy particles (argon) generated by plasma with a film-forming material (target), which knocks out the material components and deposits them onto a substrate such as glass or silicon wafers to form a thin film. Our company also offers coating services using the sputtering method, in addition to ion plating and vacuum deposition methods. Currently, the types of films available using the sputtering method are Ti, TiN, and TiC.
- Company：東邦化研
- Price：Other
